The LOMSS laboratory focuses on research, development, design, analysis, optimization, and implementation of advanced experimental and simulation techniques for photonic and electronic systems. Current LOMSS projects address:

• Advanced characterizations of semiconductor packaging materials
• Adhesion analysis of critical interfaces in photonic and semiconductor devices
• Moisture and gas diffusion analysis of semiconductor packages and packaging materials
• Hermeticity testing and analysis of MEMS devices
• Reliability analysis of packages and package assemblies
• Experimental micro and nanomechanics (development of optical methods)
• Non-linear structural modeling of photonics and microelectronic devices subjected to thermal-hygroscopic-mechanical loadings
• Optical performance characterization of high power LEDs
• Design of LED-based lighting systems
• Reliability analysis of HP-LEDs and LED-based luminaires