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Far-Infrared Interferometry

Luminous Flux Measurement System

Microscopic Moiré Interferometry

Portable Engineering Moiré Interferometry (PEMI)

Shadow Moiré Measurement System

Twyman/Green Interferometer

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Portable Engineering Moiré Interferometry (PEMI)

PEMI II is used to measure in-plane deformations of semiconductor packages. Flat surface of the specimen is replicated with diffraction grating of 2400 lines/mm, and is subjected to thermal or mechanical loading

Figure 1Figure 2

Example: Thermal deformations of WB-PBGA package assembly

Figure 3      Figure 4