Publications

Books Authored

  • D. Post, B. Han and P. Ifju, “High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials”, Mechanical Engineering Series, Springer-Verlag, NY, 1994. (Student edition, 1997)

Chapters in books

  • Inamdar, P. Gromala, A. Kabakchiev, Y. Yang and B. Han, “EMC oxidation under high temperature aging,” In: W. van Driel and M. Y. Mehr (eds.) Reliability of Organic Compounds in Microelectronics and Optoelectronics, Springer, Cham, 2022.
  • A. Inamdar, P. Gromala, A. Kabakchiev, Y. Yang and B. Han, “Chapter 3 EMC oxidation under high temperature aging,” Reliability of Organic Compounds in Microelectronics and Optoelectronics, W. van Driel, K. Zhang, X. Fan, and M. Mehr (Eds.), Springer, NY, 2021 (to be published).
  • D.-S. Kim and B. Han, “Chapter 7 Thermal Characterization of Die-Attach Material Interface of High Power Light Emitting Diodes,” Solid State Lighting Reliability Part 2, W. van Driel, X. Fan, and K. Zhang, ed., Springer, NY, 2017.
  • B. Han, B.-M. Song and M. Arik, “Chapter 18 Hierarchical Reliability Assessment Models for Novel LED-Based Recessed Down Lighting Systems,” Solid State Lighting Reliability, W. van Driel, X. Fan, ed., Springer, NY, 2012.
  • E. Stellrecht, B. Han and M, Pecht, “Ch. 5 Characterization of Hygroscopic Deformations by Moiré Interferometry,” Moisture Sensitivity of Plastic Packages of IC Devices, X. Fan and E. Suhir, ed., Springer, NY, 2010.
  • C. Jang and B. Han, Ch. 8 Modeling of Moisture Diffusion and Moisture-induced Stresses in Semiconductor and MEMS Packages, Moisture Sensitivity of Plastic Packages of IC Devices, X. Fan and E. Suhir eds., Springer, NY, 2010.
  • B. Han and D. Post, Chap 21, “Geometric Moire,” Handbook on Experimental Mechanics, W. N. Sharpe, Jr., ed., Springer-Verlag, NY, 2008.
  • D. Post and B. Han, Chap 22, “Moire Interferometry,” Handbook on Experimental Mechanics, W. N. Sharpe, Jr., ed., Springer-Verlag, NY, 2008.
  • B. Han, “14. Characterization of Stresses and Strains in Microelectronic and Photonic Devices Using Photomechanics Methods,” Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer,
  • A. Bar-Cohen, B. Han and K.-J. Kim, “2. Thermo-optic Effects on Polymer Bragg Grating,” Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer, NY, 2007.
  • B. Han et al., Chap. 2, “Strain Measurements at the Limit-the Moiré Microscope,” Handbook of Moiré Measurements, Colin Walker, ed., the Institute of Physics, 2004.
  • B. Han et al., Chap. 4, “Electronic Packaging,” Handbook of Moiré Measurements, Colin Walker, ed., the Institute of Physics, 2004.
  • D. Post, B. Han and P. Ifju, Chap. 7, “Moiré Methods for Engineering and Science – Moiré Interferometry and Shadow Moiré,” Photomechanics for Engineers, Pramod Rastogi, ed., Springer-Verlag, 2000.
  • D. Post, B. Han and P. Ifju, Chap. 24, “Moiré Interferometry,” Trends in Optical Nondestructive Testing and Inspection, R. K. Rastogi, D. Inaudi, ed., Elsvier Science, 2000.

Refereed Conference Proceeding Books (edited)

  • R. Mahajan, B. Han and D. Barker, ed., Experimental/Numerical Mechanics in Electronics Packaging, Vol. 2, Society for Experimental Mechanics, Bethel, CT, 1998.
  • B. Han, R. Mahajan and D. Barker, ed., Experimental/Numerical Mechanics in Electronics Packaging, Vol. 1, Society for Experimental Mechanics, Bethel, CT, April 1997.

Articles in Refereed Journal

        2022       

  • S. Phansalkar, C. Kim and B. Han, “Effect of Critical Properties of Epoxy Molding Compound on Warpage Prediction: A Critical Review,” Microelectronics Reliability, vol.130, March 2022, 114480: https://doi.org/10.1016/j.microrel.2022.114480.
  • A. Prisacaru, E. M. Oquelis, P. Gromala, B. Han, G. Q. Zhang, “Degradation Estimation and Prediction of Electronic Packages using Data Driven Approach,” IEEE Transactions on Industrial Electronics, vol. 69, no. 3, pp. 2996-3006, March 2022.

        2021       

  • C. Kim, S. Prashant Phansalkar, H.-S. Lee and B. Han, “Measurement of Effective Cure Shrinkage of Epoxy Molding Compound by FBG Sensor Using Two-Stage Curing,” Journal of Applied Polymer Science, e51620. https://doi.org/10.1002/app.51620, 2021
  • Y.-H. Yang, H.-P. Wei, B. Han, and C. Hu, “Bivariate Cut-HDMR Metamodel for Semiconductor Packaging Design Problems with a Large Number of Input Variables,” Materials, materials-1327924: DOI 10.3390/ma14164619, August 2021.
  • A Prisacaru, E. O. Guerrero, B. Chimmineni, P. Gromala, Y.-H. Yang, B. Han, and G. Zhang, “Towards Virtual Twin for Electronic Packages in Automotive Applications,” Microelectronics Reliability, Vol. 122, 114134, July 2021.
  • A. Inamdar, Y.-H. Yang, A. Prisacaru, P. Gromala, and B. Han, “High Temperature Aging of Epoxy-based Molding Compound and Its Effect on Mechanical Behavior of Molded Electronic Package,” Polymer Degradation and Stability, doi:10.1016/j.polymdegradstab.2021.109572, April 2021.
  • A. Prisacaru, E. M. Oquelis, P. Gromala, B. Han, G. Q. Zhang, “Degradation Estimation and Prediction of Electronic Packages using Data Driven Approach,” IEEE Transactions on Industrial Electronics, doi: 10.1109/TIE.2021.3068681, March 2021.
  • K. J. Kim, B. Han, and A. Bar-Cohen, “Thermal and Optical Performance of Cryogenically-Cooled Laser Diode Bars Mounted on Pin Finned Microcoolers,” Applied Physics B, 127, 43 Feb 2021.

    2020

  • Y.-H. Yang, B. Han, A. Prisacaru, P. Gromala, S. Jiang, and A. Sarwar, “In-Situ Service Load Monitoring of Automotive Electronic Systems Using Silicon-Based Piezoresistive Stress Sensor,” Microelectronics Reliability, Vol. 110, July 2020.
  • S. Phansalkar, C. Kim, B. Han, P. Gromala, “Volumetric Effective Cure Shrinkage Measurement of Dual Curable Adhesives by Fiber Bragg Grating Sensor,” Journal of Materials Science, 55(22), 9655-9664, May 2020.
  • A. Roman, B. Wu, B. Han, G. M. Reinacher, and S. G. Yousef, “Moisture Transport through Housing Materials Enclosing Critical Automotive Electronics,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 10, No. 4, pp. 541-550, April 2020.
  • H.-P. Wei, Y.-H. Yang, and B. Han, “Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part II Implementation of Stochastic Model,” Journal of Electronic Packaging, 142(1): 011002, March 2020.
  • H.-P. Wei, Y.-H. Yang, and B. Han, “Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development,” Journal of Electronic Packaging, 142(1): 011001, March 2020.

     2019       

  • B. Wu, D. Kim, B. Han, A. Palczynska, A. Prisacaru and P. J. Gromala, “Hybrid Approach to Conduct Failure Prognostics of Automotive Electronic Control Unit Using Stress Sensor as In-Situ Load Counter,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 9, no. 1, pp. 28-38, Jan. 2019.
  • J. Lee, H. Oh, C. H. Park, B. D. Youn, and B. Han, “Test Scheme and Degradation Model of Accumulated ESD Damage for IGBT Prognostics,” IEEE Transactions on Device and Materials Reliability, Vol. 19, No. 1, March 2019.
  • H.-P. Wei, Y.-H. Yang, and B. Han, “Advanced Statistical Model Calibration to Determine Manufacturing-induced Variations of Effective Elastic Properties of SAC Solder Joints in Leadless Chip Resistor Assemblies,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 9, No. 4, April 2019.
  • B. Wu, B. Han and J. Schumacher, “Measurements of Inelastic Strain Evolution of Single Solder Grain Subject to Nominal Shear Loading,” Experimental Mechanics, 59 (7), 1075-1086, 2019; DOI: 10.1007/s11340-019-00516-0, 2019.
  • A. Prisacaru, A. Palczynska, P. Gromala, B. Wu, B. Han, and G. Q. Zhang, “On the Accuracy of CMOS-based Piezoresistive Stress Sensor: Theoretical Review and Experimental Validation,” IEEE Sensors Journal, Vol. 19, No. 20, 2019.
  • W. Diao, S. Saxena, B. Han, and M. Pecht, “Algorithm to Determine the Knee Point on Capacity Fade Curves of Lithium ion Cells,” Energies, 12 (15), 2910; doi:10.3390/en12152910 (2019).

     2018        

  • B. Wu and B. Han, “Advanced Mechanical/Optical Configuration of Real-Time Moiré Interferometry for Thermal Deformation Analysis of Fan-Out Wafer Level Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 8, no. 5, pp. 764-772 (2018).
  • A. Prisacaru, A. Palczynska, A. Theissler, P. Gromala, B. Han, and G. Q. Zhang, “In Situ Failure Detection of Electronic Control Units Using Piezoresistive Stress Sensor,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, No. 5, (2018).
  • B. Wu, Y.-H. Yang, B. Han and J. Schumacher, “Measurement of Anisotropic Coefficients of Thermal Expansion of SAC305 Solder Using Surface Strains of Single Grain with Arbitrary Orientation,” Acta Materialia, Vol. 156, pp. 196-204 (2018).
  • H. S. Lee, Y. Sun, C. Kim and B. Han, “Characterization of Linear Viscoelastic Behavior of Epoxy Molding Compound Subjected to Uniaxial Compression and Hydrostatic Pressure,” IEEE Transactions on Components, Packaging and Manufacturing Technology, Vol. 8, no. 8, pp. 1363-1372, Aug. 2018.

     2017        

  • Y. Sun, H.-S. Lee, and B. Han, “Measurement of Temperature-Dependent Elastic Constants of Epoxy Molding Compound by Fiber Bragg Grating Sensor Method,” Experimental Mechanics , 57, pp. 313-324: DOI: 10.1007/s11340-016-0215-5 (2017).
  • B. Han and D.-S. Kim, “Moisture Ingress, Behavior and Prediction inside Semiconductor Packaging: A Review,” Journal of Electronic Packaging , Vol. 139, pp. 010802-1: DOI: 10.1115/1.4035598 (2017).
  • P. Zhang, D.-S. Kim, and B. Han, “Deconvolution of Spectral Power Distribution of High-power Laser Diode Arrays,” Applied Optics , Vol. 56, No. 20, pp. 5590-5598 (2017).
  • H.-P. Wei, B. Han, B. D. Youn, H. Shin, I. Kim and H. Moon, “Assembly Yield Prediction of Plastically Encapsulated Packages with a Large Number of Manufacturing Variables by Advanced Approximate Integration Method,” Microelectronics Reliability, Vol. 78, pp. 319-330 (2017).

     2016        

  • K. Mahan, B. Kim, B. Wu, B. Han, I. Kim, H. Moon, and Y. N. Hwang, “Modified Single Cantilever Adhesion Test for EMC/PSR Interface in Thin Semiconductor Packages,” Microelectronics Reliability, 63, pp. 134-141: DOI: 10.1016/j.microrel.2016.05.015 (2016).
  • K. Mahan, D. Rosen, and B. Han, “Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions,” Journal of Electronic Packaging , 138(4), 041003: DOI: 10.1115/1.4034454 (2016).
  • D.-S. Kim, C. Holloway, B.Han, and A. Bar-Cohen, “Method for Predicting Junction Temperature Distribution in High Power Laser Diode Bar,” Applied Optics , Vol. 55, No. 27, pp. 7487-7496: DOI: 10.1364/AO.55.007487 (2016).
  • Y. Sun, H.-S. Lee, and B. Han, “Measurement of Temperature-Dependent Elastic Constants of Epoxy Molding Compound by Fiber Bragg Grating Sensor Method,” Experimental Mechanics , DOI: 10.1007/s11340-016-0215-5 (2016).
  • D.-S. Kim and B. Han, “Effect of Junction Temperature on Heat Dissipation of High Power Light Emitting Diodes,” Journal of Applied Physics, 119, 125104 (2016); DOI: 10.1063/1.4944800 (2016).
  • A. Palczynsk, P.J. Gromala, D. Mayer, B. Han, and T. Melz, “In-Situ Investigation of EMC Relaxation Behavior Using Piezoresistive Stress Sensor,” Microelectronics Reliability , 62, pp. 58-62 (2016).

     2015        

  • H. Oh, B. Han, P. McCluskey, C. Han and B. D. Youn, “Physics-of-Failure, Condition Monitoring and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review,” IEEE Transactions on Power Electronics, Vol. 30, No. 5, pp. 2413-2416: DOI:10.1109/TPEL.2014.2346485 (2015).
  • D.-S. Kim, B. Han and A. Bar-Cohen, “Characterization of Die-Attach Thermal Interface of High Power Light Emitting Diodes: An Inverse Approach,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, pp. 1635-1643: DOI: 10.1109/TCPMT.2015.2472400 (2015).
  • J. M. Ha, B. D. Youn, H. Oh, B. Han and Y. Jung, “Autocorrelation-based time synchronous averaging for condition monitoring of planetary gearboxes wind turbines,” Mechanical Systems and Signal Processing, Vol. 70-71, pp. 161–175; DOI: 10.1016/j.ymssp.2015.09.040 (2015).
  • H. Oh, H.-P. Wei, B. Han and B. D. Youn, “Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation Analysis and Model Calibration,” IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2015.2510398 (2015).

     2014        

  • D.-S. Kim, B. Han and Y.-J. Kim, “Degradation Analysis of Secondary Lens System and its Effect on Performance of LED-based Luminaire,” Microelectronics Reliability, DOI:10.1016/j.microrel.2013.08.007 (2014).
  • Y. Sun, Y. Wang, Y. Kim and B. Han, “Dual-Configuration Fiber Bragg Grating Sensor Technique to Measure Coefficients of Thermal Expansion and Hygroscopic Swelling,” Experimental Mechanics, DOI: 10.1007/s11340-013-9804-8 (2014).
  • C. Han and B. Han, “ Board Level Relability Analysis of Chip Resistor Assemblies under Thermal Cycling: A Comparison Study between SnPb and SnAgCu,” Journal of Mechanical Science and Technology, Vol. 28, No.3, pp. 879-996: DOI: 10.1007/s12206-013-1154-z (2014).
  • C. Jang and B. Han, “ Hygrothermal Behavior of Advanced Polymers above Water Boiling Temperatures, ” Journal of Electronic Packaging, Vol. 136, No. 1, 011013: DOI: 10.1115/1.4026626 (2014).
  • K. Mahan, Y. Sun, B. Han, S. Han and M. Osterman, “ Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth,” Journal of Electronic Packaging, Vol. 136, No. 3, 031004: DOI: 10.1115/1.4026922 (2014).
  • Y. Sun, B. Han, E. Parsa and A. Dasgupta, “ Measurement of Effective Chemical Shrinkage and Equilibrium Modulus of Silicone Elastomer Used in Potted Electronic System,” Journal of Materials Science, Vol. 49, No. 24, pp. 8301-8310: DOI: 10.1007/s10853-014-8538-z (2014).
  • K. Mahan and B. Han, “Four Point Bending Test for Adhesion Testing of Packaging Structures: A Review,” Journal of the Microelectronics and Packaging Society, Vol. 21, No. 4, pp.33-39: DOI: 10.6117/kmeps.2014.21.4.033 (2014).

     2013        

  • B. Song, B. Han and J.-H. Lee, “Optimum Design Domain of LED-based Solid State Lighting Considering Cost, Energy Consumption and Reliability,” Microelectronics Reliability, Vol. 53, No. 3, Pages 435–442 (2013)
  • B. Song and B. Han, “SPD Deconvolution Scheme for Phosphor Converted White LED Using Multiple Gaussian Functions,” Applied Optics, Vol. 52, No. 5, pp. 1016–1024 (2013).
  • Y. Sun, Y. Wang, C. Jang, B. Han and K. Y. Choi, “ Generalized Hybrid Modeling to Determine Chemical Shrinkage and Modulus Evolution at Arbitrary Temperatures,” Experimental Mechanics, Vol. 53, No. 9, pp. 1783–1790 (2013).
  • B. Song and B. Han, “Analytical/Experimental Hybrid Approach Based on Spectral Power Distribution for Quantitative Degradation Analysis of Phosphor Converted LED,” Transactions on Device and Materials Reliability, DOI: 10.1109/TDMR.2013.2269478 (2013).

    2012 

  • B. Song, B. Han, A. Bar-Cohen, M. Arik, R. Sharma and S. Weaver, “Life Prediction of LED-Based Recess Downlight Cooled by Synthetic Jet,” Microelectronics Reliability, Vol. 52, No. 5, pp. 937–948 (2012).
  • K. Joon Kim, A. Bar-Cohen, and B. Han, “Thermal–structural modeling of polymer Bragg grating waveguides illuminated by a light emitting diode,” Applied Optics, Vol. 51, No. 6, pp. 726-734 (2012).
  • B. Han, “Measurements of True Leak Rates of MEMS Packages,” Sensors, Vol. 12, No. 3, pp. 3082-3104 (2012).
  • H.-S. Seo, B. Han and Y.-J. Kim, Numerical Study on the Mixing Performance of a Ring-Type Electroosmotic Micromixer with Different Obstacle Configurations,” J. of Nanoscience & Nanotechnology, Vol. 12, pp. 4523-4530 (2012).

    2010

  • C. Jang, B. Youn, P. F. Wang. B. Han and S.-J. Ham, “Forward-stepwise Regression Analysis for Fine Leak Batch Testing of Multiple MEMS Package,” Microelectronics Reliability, Vol. 18, No. 3, pp. 577-587 (2010).
  • C. Jang and B. Han, “Analytical and Molecular Simulation Study of Water Condensation Behavior in Mesopores with Closed Ends, The Journal of Chemical Physics, Vol. 132, 104702 (2010).
  • I. Sher, B. Han and A. Bar-Cohen, “Modified Coupled-Mode Model for Thermally Chirped Polymer Bragg Gratings,” Applied Optics, Vol. 49, No. 11, pp. 2079 – 2084 (2010).
  • C. Jang, S. Yoon and B. Han, “Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging,” IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 2, pp. 340-346 (2010).
  • H. Bi, C. Jang and B. Han, “Nano-Pattern Recognition and Correlation Technique for Sub-Nanometer In-Plane Displacement Measurement,” Experimental Mechanics, Vol. 50, No. 8, pp. 1169-1181 (2010).
  • Y. Wang, L. Woodworth and B. Han, “Simultaneous Measurement of Effective Chemical Shrinkage and Modulus Evolutions during Polymerization,” Experimental Mechanics, DOI: 10.1007/s11340-010-9410-y (2010).
  • P. Ifju and B. Han, “Recent Applications of Moiré Interferometry,” Experimental Mechanics, Experimental Mechanics, Vol. 50, No. 8, pp. 1129-1147 (2010).
  • M. Arik, J. Jackson, S. Prabhakaran, C. Seeley, R. Sharma, Y. Utturkar, S. Weaver, G. Kuenzler and B. Han, “Development of a High Lumen Solid State Down Light Application,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 668-679 (2010).
  • B. Han, C. Jang, A. Bar-Cohen and B. Song, “Coupled Thermal and Thermo-mechanical Design Assessment of High Power Light Emitting Diode,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 688-697 (2010).
  • D. W. Kim, E. Rahim, A. Bar-Cohen and B. Han, “Direct Submount Cooling of High Power LED’s,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 698-712 (2010).
  • B.-M. Song, B. Han, A. Bar-Cohen, R. Sharma and M. Arik, “Hierarchical Life Prediction Model for Actively Cooled LED-Based Luminaire,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 728-737 (2010).
  • C. Jang, B. Han and S. Yoon, “Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds over Solder Reflow Process Temperature,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 809-818 (2010).

    2009

  • C. Jang and B. Han, “Analytical Solutions of Gas Transport Problems in Inorganic/Organic Hybrid Barrier Structures,” Journal of Applied Physics, 105, 093532 (2009).
  • A. Goswami, B. Han, S.-J. Ham and B.-G. Jeong, “Quantitative Characterization of True Leak Rate of Micro to Nanoliter Packages Using a Helium Mass Spectrometer”, IEEE Transactions on Advanced Packaging, Vol. 32, No. 2, pp. 440-447 (2009).
  • C. Jang, A. Goswami and B. Han, “Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 18, No. 3, pp. 577-587 (2009).
  • C. Jang, A. Goswami, B. Han and S. Ham, “In-situ Measurement of Gas Diffusion Properties of Polymeric Seals Used in MEMS Packages by Optical Gas Leak Test,” Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 8, No. 4, 043025 (2009).

    2008

  • Y. Wang, B. Han, D. W. Kim, A. Bar-Cohen and P. Joseph, “Integrated Measurement Technique for Curing Process-dependent Mechanical Properties of Polymeric Materials Using Fiber Bragg Grating,” Experimental Mechanics, Vol. 48, pp. 107-117 (2008).
  • A. Goswami and B. Han, “On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages,”
    IEEE Transactions on Advanced Packaging    , Vol. 31, No. 1, pp. 14-21 (2008).
  • C. Jang, S. Park, B. Han and S. Yoon, “Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem, Journal of Electronic Packaging, Vol. 130, pp. 011004 (2008).
  • S. Yoon, C. Jang and B. Han, “Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading,” Journal of Electronic Packaging, Vol. 130, 024502-1/6 (2008).
  • C. Jang, Y. Cho and B. Han, “Ideal Laminate Theory for Water Transport Analysis of Inorganic/Organic Multilayer Barrier Films,” Applied Physics Letters, Vol. 93, 13307 (2008).
  • A. Goswami and B. Han, “On Applicability of MIL-Spec-Based Helium Fine Leak Test to Packages with Sub-micro liter Cavity Volumes”, Microelectronics Reliability, Vol. 48, pp. 1815–1821 (2008).

    2007

  • B. Han, “Advanced Iterative Algorithm for Randomly Phase-Shifted Interferograms with Intra- and Inter-Frame Intensity Variations,” Optics and Lasers in Engineering, Vol. 45, pp. 274–280 (2007).
  • C. Han and B. Han, “Phase-shifting in Achromatic Moiré Interferometry System,” Optics Express, Vol. 15, pp. 9970-9976 (2007).
  • K. J. Kim, A. Bar-Cohen and B. Han, “Thermo-Optical Modeling of Intrinsically Heated Polymer Fiber Bragg Grating,” Applied Optics, Vol. 46, No. 20 , pp. 4437-4370 (2007).
  • S. Yoon, B. Han and Z. Wang, “On Moisture Diffusion Modeling Using Thermal-Moisture Analogy,” Journal of Electronic Packaging, Vol. 129, pp. 421-426 (2007).
  • K. J. Kim, A. Bar-Cohen and B. Han, “Thermo-Optical Modeling of Polymer Fiber Bragg Grating Illuminated by Light Emitting Diode,” International Journal of Heat and Mass Transfer, Vol. 50, pp. 5241–5248 (2007).

    2006

  • C. Han and B. Han, “Error Analysis of Phase Shifting Technique When Applied to Shadow Moiré,” Applied Optics, Vol. 45, No. 6, pp. 1124-1133 (2006).
  • C. Han and B. Han, “High Sensitivity Shadow Moiré Using Nonzero-Order Talbot Distance,” Experimental Mechanics, Vol. 46, pp. 543-554 (2006).

    2005

  • Z. Wang, J. F. Cárdenas-García and B. Han, “Inverse Method to Determine Elastic Constants Using a Circular Disc and Moiré Interferometry,” Experimental Mechanics, Vol. 45, No. 1, pp. 27-34 (2005).
  • J. Joo, S. Cho and B. Han, “Characterization of Flexural and Thermo-mechanical Behavior of Plastic Ball Grid Package Assembly Using Moiré Interferometry,” Microelectronics Reliability, Vol. 46, pp. 637-646 (2005).
  • C. Han and B. Han, “Contrast of Shadow Moiré at High Order Talbot Distances,” Optical Engineering, Vol. 44, No. 2, 28002:1-6 (2005).

    2004

  • M. Mello, B. Han and Z. Wang, “Infrared Diffraction Interferometer for Co-planarity Measurement of High Density Solder Bump Pattern,” Optical Engineering, Vol. 43, No. 4, pp. 888-894, (2004).
  • Z. Wang and B. Han, “Advanced Iterative Algorithm for Phase Extraction of Randomly Phase-Shifted Interferograms,” Optics Letters, Vol. 29, No. 14, pp. 1671-1673, (2004).
  • S.-M. Cho, B. Han and J. Joo, “Temperature Dependent Deformation Analysis of Ball Grid Array Package Assembly under Accelerated Thermal Cycling Condition,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 126, pp. 41-47 (2004).
  • E. Stellrecht, B. Han and M. Pecht, “Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages,” IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 3, pp. 499-506 (2004).
  • K. Verma and B. Han, “Real-time Observation of Thermally Induced Warpage of Flip-Chip Package Using Far Infrared Fizeau Interferometry,” Experimental Mechanics, Vol. 44, No. 6, pp. 628-633, (2004).

    2003

  • E. Stellrecht, B. Han, and M. Pecht, “Measurement of the Hygroscopic Swelling Coefficient in Mold Compounds Using Moiré Interferometry,” Experimental Techniques, Vol. 27, No. 4, pp. 40-44, (2003).
  • (Invited Paper) B. Han, “Thermal Stresses in Microelectronics Subassemblies: Quantitative Characterization using Photomechanics Methods,” Journal of Thermal Stresses, Vol. 26, pp. 583-613 (2003).

    2002

  • S.-M. Cho, S.-Y. Cho and B. Han, “Observing Real-Time Thermal Deformations in Electronic Packaging”, Experimental Techniques,” Experimental Techniques, Vol. 26, No. 3, pp. 25-29, (2002).

    2001

  • (Invited Paper) B. Han, D. Post and P. Ifju, “Moiré Interferometry for Engineering Mechanics: Current Practice and Future Development”, Journal of Strain Analysis, Vol. 36, No. 1, pp. 101-117 (2001).
  • K. Verma and B. Han, “Far Infrared Fizeau Interferometry,” Applied Optics, Vol. 40, No. 28, pp. 4981-4987, (2001).
  • K. Verma and B. Han, “Sensitivity Enhancement of Far Infrared Fizeau Interferometry by Digital Image Processing,” Optical Engineering, Vol. 40, No. 9, pp. 1970-1977, (2001).
  • B. Han, Z. Wu and S.-Y. Cho, “Measurement of Thermal Expansion Coefficient of Flexible Substrate by Moiré Interferometry,” Experimental Techniques, Vol. 25, No. 3, pp. 22-25, (2001).
  • K. Verma, B. Han, S.-.B Park, and W. Ackerman, “On the Design Parameters of Flip-chip PBGA Package Assembly for Optimum Solder Ball Reliability,” IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, pp. 300-307, (2001).

    2000

  • B. Han and P. Kunthong, “Micro-mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-chip Package: An Experimental Study,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 122, No. 3, pp. 294-300 (2000).
  • K. Verma and B. Han, “Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 122. No. 3, pp. 227-232 (2000).

    1999

  • K. Verma, D. Columbus and B. Han, “Development of Real Time/Variable Sensitivity Warpage Measurement Technique and its Application to Plastic Ball Grid Array Package,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22, No. 1, pp. 63-70 (1999).
  • B. Han, D. Columbus, Z. Wu and J. Lu “Mechanical Fringe Shifting in Moiré Interferometry,” Experimental Techniques, Vol. 23, No. 1, pp. 16-19 (1999).

    1998

  • Z. Wu, J. Lu and B. Han, “Study of Residual Stress Distribution by A Combined Method of Moiré Interferometry and Incremental Hole Drilling-Part I: Theory,” Journal of Applied Mechanics, Vol. 65, pp. 837-843 (1998).
  • Z. Wu, J. Lu, and B. Han, “Study of Residual Stress Distribution by A Combined Method of Moiré Interferometry and Incremental Hole Drilling-Part II: Implementation,” Journal of Applied Mechanics, Vol. 65, pp. 844-850 (1998).
  • B. Han, “Recent Advancement of Moiré and Microscopic Moiré Interferometry for Thermal Deformation Analyses of Microelectronics Devices, Experimental Mechanics, Vol. 38, No. 4, pp. 278-288 (1998).

    1997

  • B. Han, “Deformation Mechanism of Two-Phase Solder Column Interconnections under Highly Accelerated Thermal Cycling Condition: An Experimental Study,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 119, No. 3, pp. 189-196 (1997).

    1996

  • B. Han and A. L. Wang, “Isochromatic Fringe Sharpening and Interpolation along an Isoclinic Contour, with Applications to Fracture Mechanics,” Experimental Mechanics, Vol. 36, No. 4, pp. 305-311 (1996).
  • B. Han, “Micromechanical Deformation Analysis of b alloy Titanium in Elastic and Elastic/Plastic Tension,” Experimental Mechanics, Vol. 36, No. 2, pp. 120-126 (1996).
  • B. Han, “Micromechanical Thermal Deformation Analysis of Unidirectional Boron/Aluminum Metal-Matrix Composite,” Optics and Lasers in Engineering, Vol. 24, pp. 455-466 (1996).
  • B. Han, Y. Guo, C. K. Lim and D. Caletka, “Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 118, No. 3, pp. 157-163 (1996).
  • B. Han and Y. Guo, “Determination of Effective Coefficient of Thermal Expansion of Electronic Packaging Components: A Whole-field Approach,” IEEE Transactions on Components and Packaging Technologies, Vol. 19, pp. 240-247 (1996).

    1995

  • B. Han and Y. Guo, “Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 117, No. 3, 185-191 (1995).
  • D. H. Mollenhauer, P. Ifju and B. Han, “A Compact, Robust, and Versatile Moiré Interferometer,” Optics and Lasers in Engineering, Vol. 23, No. 1, pp. 29-40 (1995).

    1994

  • B. Han and A. L. Wang, “Isochromatic Fringe Sharpening and Multiplication,” Experimental Techniques, Vol. 18, No. 6, pp. 11-13 (1994).
  • D. Post, J. D. Wood, B. Han, V. J. Parks and F. P. Gerstle, “Thermal Stresses in a Bimaterial Joint: An Experimental Analysis,” Journal of Applied Mechanics, Vol. 61, No. 1, pp. 192-198, (1994).

    1993

  • B. Han, P. Ifju and D. Post, “Geometric Moiré Methods with Enhanced Sensitivity by Optical/Digital Fringe Multiplication,” Experimental Mechanics, Vol. 33, No. 2, pp. 195-200 (1993).
  • B. Han, “Interferometric Methods with Enhanced Sensitivity by Optical/Digital Fringe Multiplication,” Applied Optics, Vol. 32, No. 25, pp. 4713-4718 (1993).
  • Y. Guo, D. Post and B. Han, “Thick Composites in Compression: An Experimental Study of Micromechanical Behavior and Smeared Engineering Properties, Journal of Composite Materials, Vol. 26, No. 13, pp. 1930-1944 (1993).

    1992

  • B. Han and D. Post, “Immersion Interferometer for Microscopic Moiré Interferometry,” Experimental Mechanics, Vol. 32, No. 1, pp. 38-41 (1992).
  • B. Han, “Higher Sensitivity Moiré Interferometry for Micromechanics Studies,” Optical
    Engineering    , Vol. 31, No. 7, pp. 1517-1526 (1992).

    1990

  • J. Morton, D. Post, B. Han and M. Y. Tsai, “A Localized Hybrid Method of Stress Analysis: A Combination of Moiré Interferometry and FEM,” Experimental Mechanics, Vol. 30, No. 2, pp. 195-200 (1990).

    1989

  • B. Han and D. Post, “The Tilted Plate Method for Introducing Carrier Fringes of Extension in Moiré Interferometry,” Experimental Techniques, Vol. 13, No. 7, pp. 25-29 (1989).