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Clark School

Publications

a. Books

Books Authored

  1. D. Post, B. Han and P. Ifju, "High Sensitivity Moiré: Experimental Analysis for Mechanics and Materials", Mechanical Engineering Series, Springer-Verlag, NY, 1994. (Student edition, 1997)  

Chapters in books

  1. B. Han, B.-M. Song and M. Arik, “Chapter 18 Hierarchical Reliability Assessment Models for Novel LED-Based Recessed Down Lighting Systems,” Solid State Lighting Reliability, van Driel, Willem Dirk; Fan, X.J. (Eds.), Springer, NY, 2012.
  2. E. Stellrecht, B. Han and M, Pecht, “Ch. 5 Characterization of Hygroscopic Deformations by Moiré Interferometry,” Moisture Sensitivity of Plastic Packages of IC Devices, X. Fan and E. Suhir eds., Springer, NY, 2010.
  3. C. Jang and B. Han, Ch. 8 Modeling of Moisture Diffusion and Moisture-induced Stresses in Semiconductor and MEMS Packages, Moisture Sensitivity of Plastic Packages of IC Devices, X. Fan and E. Suhir eds., Springer, NY, 2010.
  4. B. Han and D. Post, Chap 21, “Geometric Moire,” Handbook on Experimental Mechanics, W. N. Sharpe, Jr., ed., Springer-Verlag, NY, 2008.
  5. D. Post and B. Han, Chap 22, “Moire Interferometry,” Handbook on Experimental Mechanics, W. N. Sharpe, Jr., ed., Springer-Verlag, NY, 2008.
  6. B. Han, “14. Characterization of Stresses and Strains in Microelectronic and Photonic Devices Using Photomechanics Methods,” Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer,
  7. A. Bar-Cohen, B. Han and K.-J. Kim, “2. Thermo-optic Effects on Polymer Bragg Grating,” Micro-and Optoelectronic Materials and Structures: Physics, Mechanics, Design, Reliability, and Packaging, Y. C. Lee and A. Suhir, ed., Springer, NY, 2007.
  8. B. Han et al., Chap. 2, “Strain Measurements at the Limit-the Moiré Microscope,” Handbook of Moiré Measurements, Colin Walker, ed., the Institute of Physics, 2004.
  9. B. Han et al., Chap. 4, “Electronic Packaging,” Handbook of Moiré Measurements, Colin Walker, ed., the Institute of Physics, 2004.
  10. D. Post, B. Han and P. Ifju, Chap. 7, “Moiré Methods for Engineering and Science – Moiré Interferometry and Shadow Moiré,” Photomechanics for Engineers, Pramod Rastogi, ed., Springer-Verlag, 2000.
  11. D. Post, B. Han and P. Ifju, Chap. 24, “Moiré Interferometry,” Trends in Optical Nondestructive Testing and Inspection, R. K. Rastogi, D. Inaudi, ed., Elsvier Science, 2000.

Refereed Conference Proceeding Books (edited)

  1. R. Mahajan, B. Han and D. Barker, ed., Experimental/Numerical Mechanics in Electronics Packaging, Vol. 2, Society for Experimental Mechanics, Bethel, CT, 1998.
  2. B. Han, R. Mahajan and D. Barker, ed., Experimental/Numerical Mechanics in Electronics Packaging, Vol. 1, Society for Experimental Mechanics, Bethel, CT, April 1997.

b. Articles in Refereed Journals

Published

 2016        

  1. K. Mahan, B. Kim, B. Wu, B. Han, I. Kim, H. Moon, and Y. N. Hwang, “Modified Single Cantilever Adhesion Test for EMC/PSR Interface in Thin Semiconductor Packages,” Microelectronics Reliability, 63, 134-141: DOI: 10.1016/j.microrel.2016.05.015 (2016).
  2. K. Mahan, D. Rosen, and B. Han, “Blister Testing for Adhesion Strength Measurement of Polymer Films Subjected to Environmental Conditions,” Journal of Electronic Packaging , 138(4), 041003: DOI: 10.1115/1.4034454 (2016).
  3. D.-S. Kim, C. Holloway, B.Han, and A. Bar-Cohen, “Method for Predicting Junction Temperature Distribution in High Power Laser Diode Bar,” Applied Optics , Vol. 55, No. 27, pp. 7487-7496: DOI: 10.1364/AO.55.007487 (2016).
  4. Y. Sun, H.-S. Lee, and B. Han, “Measurement of Temperature-Dependent Elastic Constants of Epoxy Molding Compound by Fiber Bragg Grating Sensor Method,” Experimental Mechanics , DOI: 10.1007/s11340-016-0215-5 (2016).
  5. D.-S. Kim and B. Han, “Effect of Junction Temperature on Heat Dissipation of High Power Light Emitting Diodes,” Journal of Applied Physics, 119, 125104 (2016); DOI: 10.1063/1.4944800 (2016).

     2015        

  6. H. Oh, B. Han, P. McCluskey, C. Han and B. D. Youn, “Physics-of-Failure, Condition Monitoring and Prognostics of Insulated Gate Bipolar Transistor Modules: A Review,” IEEE Transactions on Power Electronics, Vol. 30, No. 5, pp. 2413-2416: DOI:10.1109/TPEL.2014.2346485 (2015).
  7. D.-S. Kim, B. Han and A. Bar-Cohen, “Characterization of Die-Attach Thermal Interface of High Power Light Emitting Diodes: An Inverse Approach,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 5, pp. 1635-1643: DOI: 10.1109/TCPMT.2015.2472400 (2015).
  8. J. M. Ha, B. D. Youn, H. Oh, B. Han and Y. Jung, “Autocorrelation-based time synchronous averaging for condition monitoring of planetary gearboxes wind turbines,” Mechanical Systems and Signal Processing, Vol. 70-71, pp. 161175; DOI: 10.1016/j.ymssp.2015.09.040 (2015).
  9. H. Oh, H.-P. Wei, B. Han and B. D. Youn, “Probabilistic Lifetime Prediction of Electronic Packages Using Advanced Uncertainty Propagation Analysis and Model Calibration,” IEEE Transactions on Components, Packaging and Manufacturing Technology, DOI: 10.1109/TCPMT.2015.2510398 (2015).

     2014        

  10. D.-S. Kim, B. Han and Y.-J. Kim, “Degradation Analysis of Secondary Lens System and its Effect on Performance of LED-based Luminaire,” Microelectronics Reliability, DOI:10.1016/j.microrel.2013.08.007 (2014).
  11. Y. Sun, Y. Wang, Y. Kim and B. Han, “Dual-Configuration Fiber Bragg Grating Sensor Technique to Measure Coefficients of Thermal Expansion and Hygroscopic Swelling,” Experimental Mechanics, DOI: 10.1007/s11340-013-9804-8 (2014).
  12. C. Han and B. Han, “ Board Level Relability Analysis of Chip Resistor Assemblies under Thermal Cycling: A Comparison Study between SnPb and SnAgCu,” Journal of Mechanical Science and Technology, Vol. 28, No.3, pp. 879-996: DOI: 10.1007/s12206-013-1154-z (2014).
  13. C. Jang and B. Han, “ Hygrothermal Behavior of Advanced Polymers above Water Boiling Temperatures, ” Journal of Electronic Packaging, Vol. 136, No. 1, 011013: DOI: 10.1115/1.4026626 (2014).
  14. K. Mahan, Y. Sun, B. Han, S. Han and M. Osterman, “ Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth,” Journal of Electronic Packaging, Vol. 136, No. 3, 031004: DOI: 10.1115/1.4026922 (2014).
  15. Y. Sun, B. Han, E. Parsa and A. Dasgupta, “ Measurement of Effective Chemical Shrinkage and Equilibrium Modulus of Silicone Elastomer Used in Potted Electronic System,” Journal of Materials Science, Vol. 49, No. 24, pp. 8301-8310: DOI: 10.1007/s10853-014-8538-z (2014).
  16. K. Mahan and B. Han, “Four Point Bending Test for Adhesion Testing of Packaging Structures: A Review,” Journal of the Microelectronics and Packaging Society, Vol. 21, No. 4, pp.33-39: DOI: 10.6117/kmeps.2014.21.4.033 (2014).

     2013        

  17. B. Song, B. Han and J.-H. Lee, “Optimum Design Domain of LED-based Solid State Lighting Considering Cost, Energy Consumption and Reliability,” Microelectronics Reliability, Vol. 53, No. 3, Pages 435–442 (2013)
  18. B. Song and B. Han, “SPD Deconvolution Scheme for Phosphor Converted White LED Using Multiple Gaussian Functions,” Applied Optics, Vol. 52, No. 5, pp. 1016–1024 (2013).
  19. Y. Sun, Y. Wang, C. Jang, B. Han and K. Y. Choi, “ Generalized Hybrid Modeling to Determine Chemical Shrinkage and Modulus Evolution at Arbitrary Temperatures,” Experimental Mechanics, Vol. 53, No. 9, pp. 1783–1790 (2013).
  20. B. Song and B. Han, “Analytical/Experimental Hybrid Approach Based on Spectral Power Distribution for Quantitative Degradation Analysis of Phosphor Converted LED,” Transactions on Device and Materials Reliability, DOI: 10.1109/TDMR.2013.2269478 (2013).

    2012 

  21. B. Song, B. Han, A. Bar-Cohen, M. Arik, R. Sharma and S. Weaver, “Life Prediction of LED-Based Recess Downlight Cooled by Synthetic Jet,” Microelectronics Reliability, Vol. 52, No. 5, pp. 937–948 (2012).
  22. K. Joon Kim, A. Bar-Cohen, and B. Han, “Thermal–structural modeling of polymer Bragg grating waveguides illuminated by a light emitting diode,” Applied Optics, Vol. 51, No. 6, pp. 726-734 (2012).
  23. B. Han, “Measurements of True Leak Rates of MEMS Packages,” Sensors, Vol. 12, No. 3, pp. 3082-3104 (2012).
  24. H.-S. Seo, B. Han and Y.-J. Kim, Numerical Study on the Mixing Performance of a Ring-Type Electroosmotic Micromixer with Different Obstacle Configurations,” J. of Nanoscience & Nanotechnology, Vol. 12, pp. 4523-4530 (2012).

    2010

  25. C. Jang, B. Youn, P. F. Wang. B. Han and S.-J. Ham, “Forward-stepwise Regression Analysis for Fine Leak Batch Testing of Multiple MEMS Package,” Microelectronics Reliability, Vol. 18, No. 3, pp. 577-587 (2010).
  26. C. Jang and B. Han, “Analytical and Molecular Simulation Study of Water Condensation Behavior in Mesopores with Closed Ends, The Journal of Chemical Physics, Vol. 132, 104702 (2010).
  27. I. Sher, B. Han and A. Bar-Cohen, “Modified Coupled-Mode Model for Thermally Chirped Polymer Bragg Gratings,” Applied Optics, Vol. 49, No. 11, pp. 2079 - 2084 (2010).  
  28. C. Jang, S. Yoon and B. Han, “Measurement of the Hygroscopic Swelling Coefficient of Thin Film Polymers Used in Semiconductor Packaging,” IEEE Transactions on Components and Packaging Technologies, Vol. 33, No. 2, pp. 340-346 (2010).
  29. H. Bi, C. Jang and B. Han, “Nano-Pattern Recognition and Correlation Technique for Sub-Nanometer In-Plane Displacement Measurement,” Experimental Mechanics, Vol. 50, No. 8, pp. 1169-1181 (2010).  
  30. Y. Wang, L. Woodworth and B. Han, “Simultaneous Measurement of Effective Chemical Shrinkage and Modulus Evolutions during Polymerization,” Experimental Mechanics, DOI: 10.1007/s11340-010-9410-y (2010).
  31. P. Ifju and B. Han, “Recent Applications of Moiré Interferometry,” Experimental Mechanics, Experimental Mechanics, Vol. 50, No. 8, pp. 1129-1147 (2010).
  32. M. Arik, J. Jackson, S. Prabhakaran, C. Seeley, R. Sharma, Y. Utturkar, S. Weaver, G. Kuenzler and B. Han, “Development of a High Lumen Solid State Down Light Application,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 668-679 (2010).
  33. B. Han, C. Jang, A. Bar-Cohen and B. Song, “Coupled Thermal and Thermo-mechanical Design Assessment of High Power Light Emitting Diode,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 688-697 (2010).
  34. D. W. Kim, E. Rahim, A. Bar-Cohen and B. Han, “Direct Submount Cooling of High Power LED’s,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 698-712 (2010).
  35. B.-M. Song, B. Han, A. Bar-Cohen, R. Sharma and M. Arik, “Hierarchical Life Prediction Model for Actively Cooled LED-Based Luminaire,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 728-737 (2010).
  36. C. Jang, B. Han and S. Yoon, “Comprehensive Moisture Diffusion Characteristics of Epoxy Molding Compounds over Solder Reflow Process Temperature,” IEEE Transactions on Components and Packaging Technologies, Vol. 33. No. 4, pp. 809-818 (2010).

    2009

  37. C. Jang and B. Han, “Analytical Solutions of Gas Transport Problems in Inorganic/Organic Hybrid Barrier Structures,” Journal of Applied Physics, 105, 093532 (2009).
  38. A. Goswami, B. Han, S.-J. Ham and B.-G. Jeong, “Quantitative Characterization of True Leak Rate of Micro to Nanoliter Packages Using a Helium Mass Spectrometer”, IEEE Transactions on Advanced Packaging, Vol. 32, No. 2, pp. 440-447 (2009).
  39. C. Jang, A. Goswami and B. Han, “Hermeticity Evaluation of Polymer-Sealed MEMS Packages by Gas Diffusion Analysis,” IEEE/ASME Journal of Microelectromechanical Systems, Vol. 18, No. 3, pp. 577-587 (2009).
  40. C. Jang, A. Goswami, B. Han and S. Ham, “In-situ Measurement of Gas Diffusion Properties of Polymeric Seals Used in MEMS Packages by Optical Gas Leak Test,” Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 8, No. 4, 043025 (2009).

    2008

  41. Y. Wang, B. Han, D. W. Kim, A. Bar-Cohen and P. Joseph, “Integrated Measurement Technique for Curing Process-dependent Mechanical Properties of Polymeric Materials Using Fiber Bragg Grating,” Experimental Mechanics, Vol. 48, pp. 107-117 (2008).
  42. A. Goswami and B. Han, “On Ultra-Fine Leak Detection of Hermetic Wafer Level Packages,”
    IEEE Transactions on Advanced Packaging
    , Vol. 31, No. 1, pp. 14-21 (2008).
  43. C. Jang, S. Park, B. Han and S. Yoon, “Advanced Thermal-Moisture Analogy Scheme for Anisothermal Moisture Diffusion Problem, Journal of Electronic Packaging, Vol. 130, pp. 011004 (2008).
  44. S. Yoon, C. Jang and B. Han, “Nonlinear Stress Modeling Scheme to Analyze Semiconductor Packages Subjected to Combined Thermal and Hygroscopic Loading,” Journal of Electronic Packaging, Vol. 130, 024502-1/6 (2008).
  45. C. Jang, Y. Cho and B. Han, “Ideal Laminate Theory for Water Transport Analysis of Inorganic/Organic Multilayer Barrier Films,” Applied Physics Letters, Vol. 93, 13307 (2008).
  46. A. Goswami and B. Han, “On Applicability of MIL-Spec-Based Helium Fine Leak Test to Packages with Sub-micro liter Cavity Volumes”, Microelectronics Reliability, Vol. 48, pp. 1815–1821 (2008).

    2007

  47. B. Han, “Advanced Iterative Algorithm for Randomly Phase-Shifted Interferograms with Intra- and Inter-Frame Intensity Variations,” Optics and Lasers in Engineering, Vol. 45, pp. 274–280 (2007).
  48. C. Han and B. Han, “Phase-shifting in Achromatic Moiré Interferometry System,” Optics Express, Vol. 15, pp. 9970-9976 (2007).
  49. K. J. Kim, A. Bar-Cohen and B. Han, “Thermo-Optical Modeling of Intrinsically Heated Polymer Fiber Bragg Grating,” Applied Optics, Vol. 46, No. 20 , pp. 4437-4370 (2007).
  50. S. Yoon, B. Han and Z. Wang, “On Moisture Diffusion Modeling Using Thermal-Moisture Analogy,” Journal of Electronic Packaging, Vol. 129, pp. 421-426 (2007).
  51. K. J. Kim, A. Bar-Cohen and B. Han, “Thermo-Optical Modeling of Polymer Fiber Bragg Grating Illuminated by Light Emitting Diode,” International Journal of Heat and Mass Transfer, Vol. 50, pp. 5241–5248 (2007).

    2006

  52. C. Han and B. Han, “Error Analysis of Phase Shifting Technique When Applied to Shadow Moiré,” Applied Optics, Vol. 45, No. 6, pp. 1124-1133 (2006).
  53. C. Han and B. Han, “High Sensitivity Shadow Moiré Using Nonzero-Order Talbot Distance,” Experimental Mechanics, Vol. 46, pp. 543-554 (2006).

    2005

  54. Z. Wang, J. F. Cárdenas-García and B. Han, “Inverse Method to Determine Elastic Constants Using a Circular Disc and Moiré Interferometry,” Experimental Mechanics, Vol. 45, No. 1, pp. 27-34 (2005).
  55. J. Joo, S. Cho and B. Han, “Characterization of Flexural and Thermo-mechanical Behavior of Plastic Ball Grid Package Assembly Using Moiré Interferometry,” Microelectronics Reliability, Vol. 46, pp. 637-646 (2005).
  56. C. Han and B. Han, “Contrast of Shadow Moiré at High Order Talbot Distances,” Optical Engineering, Vol. 44, No. 2, 28002:1-6 (2005).

    2004

  57. M. Mello, B. Han and Z. Wang, “Infrared Diffraction Interferometer for Co-planarity Measurement of High Density Solder Bump Pattern,” Optical Engineering, Vol. 43, No. 4, pp. 888-894, (2004). 
  58. Z. Wang and B. Han, “Advanced Iterative Algorithm for Phase Extraction of Randomly Phase-Shifted Interferograms,” Optics Letters, Vol. 29, No. 14, pp. 1671-1673, (2004). 
  59. S.-M. Cho, B. Han and J. Joo, “Temperature Dependent Deformation Analysis of Ball Grid Array Package Assembly under Accelerated Thermal Cycling Condition,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 126, pp. 41-47 (2004).
  60. E. Stellrecht, B. Han and M. Pecht, “Characterization of Hygroscopic Swelling Behavior of Mold Compounds and Plastic Packages,” IEEE Transactions on Components and Packaging Technologies, Vol. 27, No. 3, pp. 499-506 (2004).
  61. K. Verma and B. Han, “Real-time Observation of Thermally Induced Warpage of Flip-Chip Package Using Far Infrared Fizeau Interferometry,” Experimental Mechanics, Vol. 44, No. 6, pp. 628-633, (2004).

    2003

  62. E. Stellrecht, B. Han, and M. Pecht, “Measurement of the Hygroscopic Swelling Coefficient in Mold Compounds Using Moiré Interferometry,” Experimental Techniques, Vol. 27, No. 4, pp. 40-44, (2003). 
  63. (Invited Paper) B. Han, “Thermal Stresses in Microelectronics Subassemblies: Quantitative Characterization using Photomechanics Methods,” Journal of Thermal Stresses, Vol. 26, pp. 583-613 (2003).

    2002

  64. S.-M. Cho, S.-Y. Cho and B. Han, “Observing Real-Time Thermal Deformations in Electronic Packaging”, Experimental Techniques,” Experimental Techniques, Vol. 26, No. 3, pp. 25-29, (2002).

    2001

  65. (Invited Paper) B. Han, D. Post and P. Ifju, “Moiré Interferometry for Engineering Mechanics: Current Practice and Future Development”, Journal of Strain Analysis, Vol. 36, No. 1, pp. 101-117 (2001). 
  66. K. Verma and B. Han, “Far Infrared Fizeau Interferometry,” Applied Optics, Vol. 40, No. 28, pp. 4981-4987, (2001). 
  67. K. Verma and B. Han, “Sensitivity Enhancement of Far Infrared Fizeau Interferometry by Digital Image Processing,” Optical Engineering, Vol. 40, No. 9, pp. 1970-1977, (2001). 
  68. B. Han, Z. Wu and S.-Y. Cho, “Measurement of Thermal Expansion Coefficient of Flexible Substrate by Moiré Interferometry,” Experimental Techniques, Vol. 25, No. 3, pp. 22-25, (2001). 
  69. K. Verma, B. Han, S.-.B Park, and W. Ackerman, “On the Design Parameters of Flip-chip PBGA Package Assembly for Optimum Solder Ball Reliability,” IEEE Transactions on Components and Packaging Technologies, Vol. 24, No. 2, pp. 300-307, (2001).

    2000

  70. B. Han and P. Kunthong, “Micro-mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-chip Package: An Experimental Study,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 122, No. 3, pp. 294-300 (2000). 
  71. K. Verma and B. Han, “Warpage Measurement on Dielectric Rough Surfaces of Microelectronics Devices by Far Infrared Fizeau Interferometry,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 122. No. 3, pp. 227-232 (2000). 

    1999

  72. K. Verma, D. Columbus and B. Han, “Development of Real Time/Variable Sensitivity Warpage Measurement Technique and its Application to Plastic Ball Grid Array Package,” IEEE Transactions on Electronics Packaging Manufacturing, Vol. 22, No. 1, pp. 63-70 (1999).
  73. B. Han, D. Columbus, Z. Wu and J. Lu “Mechanical Fringe Shifting in Moiré Interferometry,” Experimental Techniques, Vol. 23, No. 1, pp. 16-19 (1999).

    1998

  74. Z. Wu, J. Lu and B. Han, “Study of Residual Stress Distribution by A Combined Method of Moiré Interferometry and Incremental Hole Drilling-Part I: Theory,” Journal of Applied Mechanics, Vol. 65, pp. 837-843 (1998). 
  75. Z. Wu, J. Lu, and B. Han, “Study of Residual Stress Distribution by A Combined Method of Moiré Interferometry and Incremental Hole Drilling-Part II: Implementation,” Journal of Applied Mechanics, Vol. 65, pp. 844-850 (1998).  
  76. B. Han, “Recent Advancement of Moiré and Microscopic Moiré Interferometry for Thermal Deformation Analyses of Microelectronics Devices, Experimental Mechanics, Vol. 38, No. 4, pp. 278-288 (1998).

    1997

  77. B. Han, “Deformation Mechanism of Two-Phase Solder Column Interconnections under Highly Accelerated Thermal Cycling Condition: An Experimental Study,” Journal of Electronic Packaging, Transaction of the ASME, Vol. 119, No. 3, pp. 189-196 (1997). 

    1996

  78. B. Han and A. L. Wang, "Isochromatic Fringe Sharpening and Interpolation along an Isoclinic Contour, with Applications to Fracture Mechanics," Experimental Mechanics, Vol. 36, No. 4, pp. 305-311 (1996).
  79. B. Han, "Micromechanical Deformation Analysis of b alloy Titanium in Elastic and Elastic/Plastic Tension," Experimental Mechanics, Vol. 36, No. 2, pp. 120-126 (1996). 
  80. B. Han, "Micromechanical Thermal Deformation Analysis of Unidirectional Boron/Aluminum Metal-Matrix Composite," Optics and Lasers in Engineering, Vol. 24, pp. 455-466 (1996). 
  81. B. Han, Y. Guo, C. K. Lim and D. Caletka, "Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods," Journal of Electronic Packaging, Transaction of the ASME, Vol. 118, No. 3, pp. 157-163 (1996).
  82. B. Han and Y. Guo, "Determination of Effective Coefficient of Thermal Expansion of Electronic Packaging Components: A Whole-field Approach," IEEE Transactions on Components and Packaging Technologies, Vol. 19, pp. 240-247 (1996). 

    1995

  83. B. Han and Y. Guo, "Thermal Deformation Analysis of Various Electronic Packaging Products by Moiré and Microscopic Moiré Interferometry," Journal of Electronic Packaging, Transaction of the ASME, Vol. 117, No. 3, 185-191 (1995). 
  84. D. H. Mollenhauer, P. Ifju and B. Han, "A Compact, Robust, and Versatile Moiré Interferometer," Optics and Lasers in Engineering, Vol. 23, No. 1, pp. 29-40 (1995).

    1994

  85. B. Han and A. L. Wang, "Isochromatic Fringe Sharpening and Multiplication," Experimental Techniques, Vol. 18, No. 6, pp. 11-13 (1994). 
  86. D. Post, J. D. Wood, B. Han, V. J. Parks and F. P. Gerstle, "Thermal Stresses in a Bimaterial Joint: An Experimental Analysis," Journal of Applied Mechanics, Vol. 61, No. 1, pp. 192-198, (1994).

    1993

  87. B. Han, P. Ifju and D. Post, "Geometric Moiré Methods with Enhanced Sensitivity by Optical/Digital Fringe Multiplication," Experimental Mechanics, Vol. 33, No. 2, pp. 195-200 (1993). 
  88. B. Han, "Interferometric Methods with Enhanced Sensitivity by Optical/Digital Fringe Multiplication," Applied Optics, Vol. 32, No. 25, pp. 4713-4718 (1993).
  89. Y. Guo, D. Post and B. Han, "Thick Composites in Compression: An Experimental Study of Micromechanical Behavior and Smeared Engineering Properties, Journal of Composite Materials, Vol. 26, No. 13, pp. 1930-1944 (1993).

    1992

  90. B. Han and D. Post, "Immersion Interferometer for Microscopic Moiré Interferometry," Experimental Mechanics, Vol. 32, No. 1, pp. 38-41 (1992).
  91. B. Han, "Higher Sensitivity Moiré Interferometry for Micromechanics Studies," Optical
    Engineering
    , Vol. 31, No. 7, pp. 1517-1526 (1992).

    1990

  92. J. Morton, D. Post, B. Han and M. Y. Tsai, "A Localized Hybrid Method of Stress Analysis: A Combination of Moiré Interferometry and FEM," Experimental Mechanics, Vol. 30, No. 2, pp. 195-200 (1990).

    1989

  93. B. Han and D. Post, "The Tilted Plate Method for Introducing Carrier Fringes of Extension in Moiré Interferometry," Experimental Techniques, Vol. 13, No. 7, pp. 25-29 (1989). 

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