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Hermeticity testing and analysis of MEMS devices

More Semiconductor Packaging Research

Advanced characterizations of semiconductor packaging materials

Adhesion analysis of critical interfaces in photonic and semiconductor devices

Moisture and gas diffusion analysis of semiconductor packages and packaging materials

Hermeticity testing and analysis of MEMS devices

Reliability analysis of packages and package assemblies


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Hermeticity is a measure of the “leak-proof ness” of packages with internal cavities and is critical for ensuring proper operation of the devices/circuits enclosed in them.  In this research, the exiting conduction based governing equation is examined to investigate the volume dependant limits of the test when applied to metal sealed MEMS packages. 

Details of current research activity can be found: