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Moisture and gas diffusion analysis of semiconductor packages and packaging materials

More Semiconductor Packaging Research

Advanced characterizations of semiconductor packaging materials

Adhesion analysis of critical interfaces in photonic and semiconductor devices

Moisture and gas diffusion analysis of semiconductor packages and packaging materials

Hermeticity testing and analysis of MEMS devices

Reliability analysis of packages and package assemblies


Research Home

Semiconductor and photonics devices have unique engineering structures in that various polymeric and inorganic materials are densely packed in millimeter to micrometer-scale configurations.  While inorganic materials such as silicon, copper, aluminum, etc., are impervious to moisture and other detrimental gas species, gas transport into polymeric and inorganic materials occurs through a mechanism known as diffusion.  LOMSS has been conducting leading edge research tasks on moisture and gas diffusion analyses. 

Details of current research activities can be found: