Welcome

LOMSS focuses on design and analysis for optimum reliability of advanced semiconductor packaging.

Current LOMSS projects address:

  • Advanced characterizations of semiconductor packaging materials;
  • Reliability analysis of packages and package assemblies
    • Damage assessment and life prediction of solder interconnects
    • Advanced uncertainty propagation analysis for small event probability
  • Adhesion analysis of critical interfaces; and
  • Experimental characterization of package stresses and warpages