Modeling is an integral part of product development in the microelectronics and photonics industry. LOMSS has been using modeling extensively for design optimization for enhanced reliability.
Three major modeling areas include:
- Non-linear structural modeling of photonics and microelectronic devices subjected to thermo-mechanical loading (visco-elasticity, time-independent plasticity and creep),
- Moisture and gas diffusion transient modeling and
- Thermal conduction and convection modeling.
More Information
- Modeling [pdf]