Semiconductor Packaging

• Advanced characterizations of semiconductor packaging materials
• Reliability analysis of packages and package assemblies
• Automotive electronics reliability
• Advanced uncertainty propagation analysis for yield and filed failure prediction
• Adhesion analysis of critical interfaces in photonic and semiconductor devices
• Moisture and gas diffusion analysis of semiconductor packages and packaging materials
• Hermeticity testing and analysis of MEMS devices

Experimental Micro and Nanomechanics (Development of Optical Methods)

• Development of advanced warpage measurement techniques
• Development of real-time stress/strain measurement techniques
• Development of nano-scale deformation measurement techniques

High Power Light Emitting Diode (HP-LED) and Laser Diode (LD)

• Optical performance characterization of high power LEDs
• Reliability analysis of high power LD and LED
• Reliability analysis of LEDs and LED-based luminaires
• Characterization of die-attach thermal interface of high-power LEDS: An inverse approach
• Method for predicting junction temperature distribution in a high-power LD bar
• Design of LED-based lighting systems
• Design of LED-based dome for schizophrenia detection

Modeling

• Modeling
• Non-linear structural modeling of photonics and microelectronic devices subjected to thermal-hygroscopic-mechanical loadings