Semiconductor Packaging
- Advanced characterizations of semiconductor packaging materials
- Reliability analysis of packages and package assemblies
- Automotive electronics reliability
- Advanced uncertainty propagation analysis for yield and filed failure prediction
- Adhesion analysis of critical interfaces in photonic and semiconductor devices
- Moisture and gas diffusion analysis of semiconductor packages and packaging materials
- Hermeticity testing and analysis of MEMS devices
Experimental Micro and Nanomechanics (Development of Optical Methods)
- Development of advanced warpage measurement techniques
- Development of real-time stress/strain measurement techniques
- Development of nano-scale deformation measurement techniques
High Power Light Emitting Diode (HP-LED) and Laser Diode (LD)
- Optical performance characterization of high power LEDs
- Reliability analysis of high power LD and LED
- Reliability analysis of LEDs and LED-based luminaires
- Characterization of die-attach thermal interface of high-power LEDS: An inverse approach
- Method for predicting junction temperature distribution in a high-power LD bar
- Design of LED-based lighting systems
- Design of LED-based dome for schizophrenia detection
Modeling
- Modeling
- Non-linear structural modeling of photonics and microelectronic devices subjected to thermal-hygroscopic-mechanical loadings